PCB exchange time: 6.5 s;
Repeatability: 2Cpk ±5.0μm 6σ (±3σ);
Hybrid squeegee head is equipped as standard, printing cycle time is reduced;
High-speed mask cleaning;
3 conveyors are equipped as standard for shorter PCB exchange time.

3D solder paste inspection machine. Featuring an expansive application range, accuracy;
Identification features including via holes, edge of board and routing to reduce false calls;
speed: 100 cm² per second @ 10 x 10 µm resolution.

Depending on the PCB you produce, you can select High-speed mode or High-accuracy mode;
PCBs up to 750 x 550 mm with component range up to L150 x W25 x T30 mm;
Higher area productivity through dual lane placement.

Excellent heat transfer with the most varied board assemblies;
Low energy consumption through intelligent energy management;
Multi-level controlled cooling;
Multi-track conveyor system (1-4 tracks)

Image signal input part Camera 3CCD camera;
Lighting series Ring LED (R.G.B);
Image resolution 10, 15, 20um;
Track adjustment Automatic adjustment;
Dimensions (W*D*H) 920*1365*1600